A. Demolliens: search on Z-Library

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1

Resistance change in memory structures integrating CuTCNQ nanowires grown on dedicated HfO2 switching layer

Ch. Muller, D. Deleruyelle, R. Müller, M. Thomas, A. Demolliens, Ch. Turquat, S. Spiga

Journal:

Solid-State Electronics

Year:

2011

Language:

english

File:

PDF, 1.35 MB

english, 2011

2

Resistive switching characteristics of NiO films deposited on top of W or Cu pillar bottom electrodes

C. Dumas, D. Deleruyelle, A. Demolliens, Ch. Muller, S. Spiga, E. Cianci, M. Fanciulli, I. Tortorelli, R. Bez

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1021 KB

english, 2011

3

Electromigration in ALCu interconnections with W-plug contacts

L. Ferlazzo, G. Reimbold, J. P. Gonchond, M. Heitzmann, O. Demolliens, G. Lormand

Journal:

Quality and Reliability Engineering International

Year:

1993

Language:

english

File:

PDF, 384 KB

english, 1993

4

An ab initio SCF + CI study of the SH3 and SF3 radicals

François Volatron, Alain Demolliens, Jean-Michel Lefour, Odile Eisenstein

Journal:

Chemical Physics Letters

Year:

1986

Language:

english

File:

PDF, 331 KB

english, 1986

5

Properties of Nb3Ge tapes for high field magnets

O. Demolliens, F. Weiss, R. Madar, J.P. Sénateur, J.C. Vallier

Journal:

Solid State Communications

Year:

1985

Language:

english

File:

PDF, 395 KB

english, 1985

6

Solution growth of metal-organic complex CuTCNQ in small dimension interconnect structures

A. Demolliens, Ch. Muller, R. Müller, Ch. Turquat, L. Goux, D. Deleruyelle, D.J. Wouters

Journal:

Journal of Crystal Growth

Year:

2010

Language:

english

File:

PDF, 1.90 MB

english, 2010

7

Wet cleanings adapted to backend processes

F. Tardif, J. Palleau, T. Lardin, O. Demolliens, A. Vincent, J. Torres

Journal:

Microelectronic Engineering

Year:

1997

Language:

english

File:

PDF, 376 KB

english, 1997

8

Study of fluorine stability in fluoro-silicate glass and effects on dielectric properties

Gérard Passemard, Pascal Fugier, Patrice Noel, Fabrice Pires, Olivier Demolliens

Journal:

Microelectronic Engineering

Year:

1997

Language:

english

File:

PDF, 398 KB

english, 1997

9

Dielectric deposition process for Cu/SiO2 integration in a dual damascene interconnection architecture

P Motte, J Torres, J Palleau, F Tardif, O Demolliens, H Bernard

Journal:

Microelectronic Engineering

Year:

2000

Language:

english

File:

PDF, 497 KB

english, 2000

10

Nonlinear flux flow in TiN superconducting thin film

F. Lefloch, C. Hoffmann, O. Demolliens

Journal:

Physica C: Superconductivity

Year:

1999

Language:

english

File:

PDF, 247 KB

english, 1999

11

Cleaning after silicon oxide CMP

F. Tardif, I. Constant, T. Lardin, O. Demolliens, M. Fayolle, Y. Gobil, J. Palleau, J. Torres

Journal:

Microelectronic Engineering

Year:

1997

Language:

english

File:

PDF, 339 KB

english, 1997

12

Formation of Al3Ti during physical vapour deposition of titanium on aluminium

L. Ulmer, F. Pitard, D. Poncet, O. Demolliens

Journal:

Microelectronic Engineering

Year:

1997

Language:

english

File:

PDF, 354 KB

english, 1997

13

Tyrosinase-Catalyzed Synthesis of a Universal Coil-Chitosan Bioconjugate for Protein Immobilization

Demolliens, Antoine, Boucher, Cyril, Durocher, Yves, Jolicoeur, Mario, Buschmann, Michael D., De Crescenzo, Gregory

Journal:

Bioconjugate Chemistry

Year:

2008

Language:

english

File:

PDF, 202 KB

english, 2008

14

Hypercoordinated XHn+1 radicals for first- and second-row atoms. A valence bond analysis

Demolliens, A., Eisenstein, O., Hiberty, Phillippe C., Lefour, J. M., Ohanessian, G., Shaik, S. S., Volatron, F.

Journal:

Journal of the American Chemical Society

Year:

1989

Language:

english

File:

PDF, 1.08 MB

english, 1989

15

Deviation from the ideal octahedral field vs. alkyl distortion in d0 metal-alkyl complexes: a MO study

Demolliens, A., Jean, Y., Eisenstein, O.

Journal:

Organometallics

Year:

1986

Language:

english

File:

PDF, 872 KB

english, 1986

16

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - New strategy to improve the mechanical strength and to reduce potential contamination of dielectric materials for double level metal integration

Assous, M., Morand, Y., Demolliens, O., Berruyer, P., Manierre, B., Gobil, Y., Louis, D., Feldis, H., Vizioz, C., Roman, A.

Year:

2000

Language:

english

File:

PDF, 316 KB

english, 2000

17

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Copper dual damascene integration using organic low k material: construction architecture comparison

Morand, Y., Assous, M., Berruyer, P., Cochet, M., Demolliens, O., Fayolle, M., Louis, D., Passemard, G., Roman, A., Verove, C., Trouiller, Y.

Year:

2000

Language:

english

File:

PDF, 535 KB

english, 2000

18

[IEEE European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet - Villard de Lans, France (1997.03.16-1997.03.19)] European Workshop Materials for Advanced Metallization, - Cleaning after silicon oxide CMP

Tardif, F., Mansart, I., Lardin, T., Demolliens, O., Fayolle, M., Gobile, Y., Palleau, J., Torres, J.

Year:

1998

Language:

english

File:

PDF, 165 KB

english, 1998

19

[IEEE 2008 9th Annual Non-Volatile Memory Technology Symposium (NVMTS) - Pacific Grove, CA, USA (2008.11.11-2008.11.14)] 2008 9th Annual Non-Volatile Memory Technology Symposium (NVMTS) - From micrometric to nanometric scale switching of CuTCNQ-based non-volatile memory structures

Thomas, M., Demolliens, A., Turquat, Ch., Deleruyelle, D., Muller, Ch., Kever, T., Bottger, U., Waser, R.

Year:

2008

Language:

english

File:

PDF, 904 KB

english, 2008

20

[IEEE 2009 IEEE International Memory Workshop (IMW) - Monterey, CA, USA (2009.05.10-2009.05.14)] 2009 IEEE International Memory Workshop - Reliability of NiO-Based Resistive Switching Memory (ReRAM) Elements with Pillar W Bottom Electrode

Demolliens, A., Muller, Ch., Deleruyelle, D., Spiga, S., Cianci, E., Fanciulli, M., Nardi, F., Cagli, C., Ielmini, D.

Year:

2009

Language:

english

File:

PDF, 427 KB

english, 2009

21

[IEEE Symposium on VLSI Technology - Kyoto, Japan (1997.06.12-1997.06.12)] Symposium on VLSI Technology - Copper Integration In Self Aligned Dual Damascene Architecture

Morand,, Lerme,, Palleau,, Torres,, Vinet,, Demolliens,, Ulmer,, Gobil,, Fayolle,, Romagna,, Le Bihan,

Year:

1997

Language:

english

File:

PDF, 339 KB

english, 1997

22

[IEEE IEEE 1999 International Interconnect Technology Conference - San Francisco, CA, USA (24-26 May 1999)] Proceedings of the IEEE 1999 International Interconnect Technology Conference (Cat. No.99EX247) - Copper-SilK integration in a 0.18 μm double level metal interconnect

Demolliens, O., Berruyer, P., Morand, Y., Tabone, C., Roman, A., Cochet, M., Assous, M., Feldis, H., Blanc, R., Tabouret, E., Louis, D., Arvet, C., Lajoinie, E., Gobil, Y., Passemard, G., Jourdan, F.,

Year:

1999

Language:

english

File:

PDF, 273 KB

english, 1999

23

[IEEE IEEE 2000 International Interconnect Technology Conference - Burlingame, CA, USA (5-7 June 2000)] Proceedings of the IEEE 2000 International Interconnect Technology Conference (Cat. No.00EX407) - Copper-SiOC-AirGap integration in a double level metal interconnect

Demolliens, O., Morand, Y., Fayolle, M., Cochet, M., Assous, M., Feldis, H., Lonis, D., Royer, J.C., Gobil, Y., Passemard, G., Maury, P., Jourdan, F., Cordeau, M., Morel, T., Perroud, L., Ulmer, L., L

Year:

2000

Language:

english

File:

PDF, 269 KB

english, 2000

24

Learning by observation in the macaque monkey under high experimental constraints

Isbaine, Faiçal, Demolliens, Marie, Belmalih, Abdelouahed, Brovelli, Andrea, Boussaoud, Driss

Journal:

Behavioural Brain Research

Year:

2015

Language:

english

File:

PDF, 1.11 MB

english, 2015

25

Differential Body Effect Analysis and Optimization of the LArge Tilt Implanted Sloped Shallow Trench Isolation Process (LATI-STI)

S. Deleonibus, M. Heitzmann, Y. Gobil, F. Martin, O. Demolliens, J. Guibert, A. Toffoli

Year:

1996

File:

PDF, 495 KB

1996

26

[IEEE European Workshop Materials for Advanced Metallization. MAM'97 Abstracts Booklet - Villard de Lans, France (1997.03.16-1997.03.19)] European Workshop Materials for Advanced Metallization, - Cleaning after silicon oxide CMP

Tardif, F., Mansart, I., Lardin, T., Demolliens, O., Fayolle, M., Gobile, Y., Palleau, J., Torres, J.

Year:

1997

Language:

english

File:

PDF, 172 KB

english, 1997

27

[IEEE 2007 Non-Volatile Memory Technology Symposium - Albuquerque, NM (2007.11.10-2007.11.13)] 2007 Non-Volatile Memory Technology Symposium - Resistance switching of CuTCNQ nanowires developed for high-density memory devices

Turquat, Ch., Demolliens, A., Razafindramora, J., Merlen, A., Valmalette, J.-C., Muller, Ch., Muller, R., Goux, L., Wouters, D.J.

Year:

2007

Language:

english

File:

PDF, 2.68 MB

english, 2007

28

On the Martensitic Transformation in V3Si

Weiss, F., Demolliens, O., Madar, R., Couach, M., Senateur, J.P.

Journal:

MRS Proceedings

Year:

1983

Language:

english

File:

PDF, 2.16 MB

english, 1983

29

SPIE Proceedings [SPIE Microelectronic Processing '93 - Monterey, CA (Sunday 26 September 1993)] Multilevel Interconnection: Issues That Impact Competitiveness - Spin on glass (SOG) etch-back planarization process: an industrial solution for 0.5-μm CMOS TLM technology

Molle, Pascale, Ullmann, H., Gros, B., Fugier, P., Demolliens, O., Hoang, Hoang H., Schutz, Ron, Bernstein, Joseph B., Vasquez, Barbara

Year:

1993

Language:

english

File:

PDF, 704 KB

english, 1993

30

Social and asocial prefrontal cortex neurons: a new look at social facilitation and the social brain

Demolliens, Marie, Isbaine, Faiçal, Takerkart, Sylvain, Huguet, Pascal, Boussaoud, Driss

Journal:

Social Cognitive and Affective Neuroscience

Year:

2017

Language:

english

File:

PDF, 1.86 MB

english, 2017

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